• N/A
    Market Cap
  • 245.23%
    1-Year Change
  • Semiconductor Equipment & Materials
    Industry

Key Performance

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  • Earnings Score: N/A
  • Momentum Score: 94
  • True Yield: N/A
  • Financial Health Score: N/A
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Latest Research & News

Applied Materials Expands AI Arsenal, Acquires NEXX In Packaging Push

Applied Materials announced the acquisition of NEXX from ASMPT Limited to expand its advanced packaging technology portfolio for AI accelerators. The stock traded up 0.47% in premarket on Monday, tracking strength in growth-leaning tech. Technical analysis shows the stock consolidating near its 52-week highs with mixed momentum signals ahead of earnings on May 14, 2026.

05/04/2026, 5:29 AM • Benzinga

Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX

Applied Materials announced a definitive agreement to acquire ASMPT Limited's NEXX business, a supplier of large-area advanced packaging deposition equipment. The acquisition will expand Applied's panel-level advanced packaging portfolio to support AI chipmakers in building larger, more efficient AI accelerators using chiplet-based designs and panel substrates larger than traditional 300mm wafers.

05/03/2026, 8:00 PM • GlobeNewswire

Circuit Fabology Files For Hong Kong IPO

Circuit Fabology, a Chinese maker of high-precision lithography tools for semiconductors and PCBs, is filing for a Hong Kong IPO. The company achieved 15% global market share in PCB direct-imaging equipment in 2024, with revenue surging 47.6% and net profit jumping 80.4% in 2025. However, it faces significant cash flow challenges with high accounts receivable and negative operating cash flow in prior years.

03/20/2026, 9:09 AM • Benzinga

Peers

Statistics

More
Day Range
$70.93
$71.31
$71.06
1-Year Range
$20.15
$78.79
$71.06
Latest Close$71.06
Change
-$0.06 (-0.08%)
Volume3,445

Information as of 06/03/2026

Company Profile

ASM Pacific Technology Ltd.
https://www.asmpt.com
N/A
Market Cap
N/A
Net Income
Sector: Technology
Industry: Semiconductor Equipment & Materials
2 Yishun Avenue 7, Singapore, Singapore, 768924
65 6752 6311

ASMPT Limited, an investment holding company, engages in the design, manufacture, and marketing of machines, tools, and materials used in the semiconductor and electronics assembly industries internationally. The company operates in two segments: Semiconductor Solutions and Surface Mount Technology Solutions. The company offers ASMPT semiconductor solutions includes advanced packing, such as laser dicing & grooving, fan out, hybrid bonding, thermos compress bonding, and die bonding; IC and discrete, including silver sintering, wire bonding, metrology, encapsulation, and singulation, trim & form; CMOS image sensor, such as inline solution, lens holder attach, curing, automated optical inspection, cleaning, active alignment, and test and calibration; and LED/ Photonics, includes FOL. It also offers ASMP SMT solutions, includes printing, inspection, placement, storage, and software. In addition, the company offers critical manufacturing of IoT data platforms. Further, it provides agency and logistics services. The company was formerly known as ASM Pacific Technology Limited and changed its name to ASMPT Limited in June 2022. ASMPT Limited was founded in 1975 and is headquartered in Singapore.

Key Executives

  • Cher Tat Ng
  • Guenter Walter Lauber
  • Yifan Xu
  • Gim Wee Pua
  • Gabriela Reckewerth

Current Ownership Distribution

  • Other45.9M (98.48%)
  • Mutual Funds497,263 (1.07%)
  • Institutions213,242 (0.46%)
  • Insiders0 (0.00%)