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- $95.7BMarket Cap
- 339.57%1-Year Change
- SemiconductorsIndustry
ASE Tech Sp ADR (ASX)
Key Performance
More- Earnings Score: N/A
- Momentum Score: 94
- True Yield: N/A
- Financial Health Score: N/A
Latest Research & News
High-End Semiconductor Packaging Market Size to Hit USD 134.90 Billion by 2035 | SNS Insider
The global high-end semiconductor packaging market is valued at USD 40.10 billion in 2025 and is expected to grow at a CAGR of 12.91% through 2035, reaching USD 134.90 billion. Growth is driven by increasing demand for AI processors, high-performance computing, data centers, and advanced consumer electronics. Asia-Pacific dominates with 68.4% market share, while flip-chip packaging leads by type at 32% market share.
03/13/2026, 4:28 AM • GlobeNewswire
Heterogeneous Integration Market Size to Grow USD 13.79 Billion by 2033 | Report by SNS Insider
The U.S. heterogeneous integration market is estimated at USD 0.47 billion in 2025 and is projected to grow at a CAGR of 22.99% through 2033, reaching USD 2.47 billion. Growth is driven by increasing demand for advanced semiconductor packaging to support AI, high-performance computing, 5G, and defense applications. However, manufacturing complexity, skill gaps, and scaling challenges may hinder growth. 3D integration and Through-Silicon Via (TSV) technologies are leading segments, with Asia Pacific dominating at 48.38% market share.
01/16/2026, 10:00 AM • GlobeNewswire
Trends in Advanced Packaging Market 2025-2035
The global advanced packaging market is expected to grow from USD 40.34 billion in 2025 to USD 78.75 billion by 2034, driven by rising demand for high-performance computing, AI, 5G devices, and compact electronics, with North America leading technological advancements.
12/15/2025, 10:58 AM • GlobeNewswire
AI Isn't Slowing -- It's Bottlenecked. TSMC Just Told Us Where.
The AI semiconductor industry is experiencing a bottleneck in advanced packaging capacity, not silicon production. TSMC remains central to AI chip manufacturing, with demand continuing to outpace supply, particularly in premium chip packaging technologies.
11/17/2025, 1:21 PM • The Motley Fool
Organic Substrate Packaging Materials Market Size, Trends, Segments, Share and Companies 2025-35
The global organic substrate packaging materials market is expected to grow from $17.40 billion in 2025 to $28.41 billion by 2034, driven by demand for miniaturized electronics, semiconductor packaging, and 5G technologies, with Asia-Pacific leading market expansion.
11/14/2025, 11:00 AM • GlobeNewswire
The global semiconductor packaging market is projected to grow from USD 55 billion in 2026 to USD 119.96 billion by 2034, with a 10.24% CAGR. Key drivers include emerging technologies like AI, 5G, and IoT, with Asia Pacific leading market growth and significant government initiatives supporting semiconductor packaging development.
11/04/2025, 11:00 AM • GlobeNewswire
InspireSemi Provides Business Update and Announces Private Placement
Inspire Semiconductor Holdings Inc. completed fabrication of its A0 Thunderbird 'supercomputer-on-a-chip' devices at TSMC and secured $3 million in private placement financing, with initial testing expected to begin in September 2025.
08/15/2025, 12:55 PM • GlobeNewswire
Ainos Posts Wider Loss in Fiscal Q2
Biotechnology company Ainos reported its Q2 2025 financial results, marking its first commercial revenue through AI Nose platform partnerships and ongoing VELDONA therapy clinical trials, while experiencing increased operating expenses and cash decline.
08/13/2025, 6:26 PM • The Motley Fool
Peers
Statistics
MoreInformation as of 06/22/2026
Company Profile
ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductor manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It operates through Packaging, Testing, and EMS. The company offers semiconductor packaging, interconnect materials production, front-end engineering testing, wafer probing, and final testing services, as well as integrated solutions for EMS (electronic manufacturing services) in relation to computing, peripherals, communications, industrial, automotive, and server applications. It also provides turnkey services, such as packaging, testing, and direct shipment of semiconductors to end users; wire bonding, including lead frame and substrate-based packages; advanced packages; heterogeneous integration; and other test-related services. In addition, the company engages in the leasing of properties; development, construction, sale, and management of real estate properties; management of parking lot; leasing of properties for shopping center; and management of commercial complex services and department store trading activities, as well as offers social, marketing and sales, information software, leasing and investing, and after-sales and sales support services. Further, it engages in the substrates production; investment advisory and warehousing management; design and manufacturing of electronic components and new electronic applications; technical advisory; management, training, and consulting of organization and human resources; projection of plastic; manufacture and sale of antennas, RF amplifiers and wave straps, PCBs, and tuners; and research and development activities. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.
Key Executives
- Tien Wu
- Rui Rong Lo
- Shi Hua Pan
- Kwai Mun Lee
- Kenneth Hsiang
Current Ownership Distribution
- Institutions2.9B (89.14%)
- Mutual Funds304.4M (9.49%)
- Insiders44.1M (1.37%)
- Other0 (0.00%)