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- N/AMarket Cap
- 149.58%1-Year Change
- Semiconductor Equipment & MaterialsIndustry
Tokyo El Unsp ADR (TOELY)
Key Performance
More- Earnings Score: N/A
- Momentum Score: 96
- True Yield: N/A
- Financial Health Score: N/A
Latest Research & News
Sputtering Equipment Market Size to Hit USD 4.19 Billion by 2035 | Research by SNS Insider
The global sputtering equipment market, valued at USD 2.41 billion in 2025, is projected to reach USD 4.19 billion by 2035, growing at a CAGR of 5.83%. Growth is driven by rising semiconductor fabrication demand, thin-film deposition applications, and expanding solar photovoltaic manufacturing. Magnetron sputtering equipment leads the market with 42.25% share, while Asia-Pacific dominates regionally with 45.35% market share.
06/19/2026, 7:30 AM • GlobeNewswire
Semiconductor Equipment Market Size to Hit USD 329.73 Billion by 2035 | Research by SNS Insider
The global semiconductor equipment market is valued at $138.64 billion in 2025 and is expected to grow to $329.73 billion by 2035, with a CAGR of 9.05%. Growth is driven by rising AI and 5G adoption, government-backed fab investments, and increasing demand across consumer electronics, automotive, and telecommunications sectors. Wafer fabrication equipment dominates the market, while testing equipment and inspection & metrology segments show the fastest growth rates.
06/16/2026, 3:30 AM • GlobeNewswire
Has the Next Leg of the AI Trade Arrived?
Chinese tech stocks surged on reports that Tencent is launching a WeChat AI assistant, suggesting the market may be shifting focus from AI infrastructure to AI adoption. Tencent, Alibaba, and Meituan led gains while Asian semiconductor stocks weakened, indicating a potential rotation in AI investment strategy.
06/02/2026, 2:42 AM • Investing
The global semiconductor etch equipment market is projected to grow at a CAGR of 8.7% from 2026 to 2032, reaching USD 28.26 billion by 2032 from USD 14.51 billion in 2024. Growth is driven by advanced semiconductor node manufacturing, AI/IoT demand, and global fab capacity expansion. However, high capital costs, supply chain disruptions, and export control constraints remain key challenges.
03/26/2026, 10:55 AM • GlobeNewswire
Rapid Thermal Processing (RTP) Equipment Market Size to Hit USD 3.90 Billion by 2035 | SNS Insider
The U.S. Rapid Thermal Processing (RTP) Equipment Market is projected to grow at a CAGR of 12.08% from 2026 to 2035, driven by increasing semiconductor fabrication, advanced node chip production, and rising demand for AI and 5G chips. The global RTP market is valued at USD 1.77 billion in 2025 and expected to reach USD 3.90 billion by 2035 with a CAGR of 8.27%. Rapid Thermal Annealing (RTA) dominates with 42% market share, while 300mm wafers lead with 64% share. Asia-Pacific holds 50.2% of the global market, with North America growing fastest at 12.60% CAGR.
03/13/2026, 5:00 AM • GlobeNewswire
The Memory Shortage Trade: 7 Stocks Goldman Says Can Keep Running
Goldman Sachs predicts a severe global memory chip shortage through 2027, with DRAM and NAND undersupply reaching 15+ year highs. This is expected to drive memory pricing up 176% for DRAM and 100-120% for NAND in 2026, pushing operating margins to record levels. Goldman identifies seven stocks positioned to benefit from this supply crunch.
02/09/2026, 12:51 PM • Benzinga
Wafer Cleaning Equipment Market Size to Hit $15.61 Billion by 2033 | Research by SNS Insider
The wafer cleaning equipment market is projected to grow from $10.23 billion in 2025 to $15.61 billion by 2033, driven by advanced semiconductor manufacturing needs and increasing demand for high-performance electronic devices.
12/14/2025, 7:00 AM • GlobeNewswire
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Statistics
MoreInformation as of 06/24/2026
Company Profile
Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor production equipment in Japan, South Korea, Taiwan, China, North America, Europe, and internationally. The company provides coaters/developers, plasma etch systems, cleaning systems, deposition systems, test systems, 3D integration systems, SiC Epitaxial CVD systems, and gas cluster beam systems, as well as other deposition and lithography and other products. It also offers engineering services; spare parts/repairs; upgrades/modification; and used products. The company was incorporated in 1951 and is based in Tokyo, Japan.
Key Executives
- Tony Kawai
- Yoshinobu Mitano
- Seisu Ikeda
- Tatsuya Nagakubo
- Sadao Sasaki
Current Ownership Distribution
- Other872.4M (95.90%)
- Institutions33.6M (3.70%)
- Mutual Funds3.6M (0.40%)
- Insiders0 (0.00%)