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- N/AMarket Cap
- 168.56%1-Year Change
- Semiconductor Equipment & MaterialsIndustry
Disco Corp (DISPF)
Key Performance
More- Earnings Score: N/A
- Momentum Score: N/A
- True Yield: N/A
- Financial Health Score: N/A
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Peers
Statistics
MoreInformation as of 06/24/2026
Company Profile
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company offers precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, inspection systems, surface planers, and waterjet saws. It also provides precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, the company is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, it leases precision machines; and purchases and sells used machines. Additionally, the company manufactures and sells precision diamond abrasive tools; and offers chargeable processing services. Disco Corporation was founded in 1937 and is based in Ota, Japan.
Key Executives
- Kazuma Sekiya
- Noboru Yoshinaga
- Naoki Abe
- Takao Tamura
- Yutaka Nishimura
Current Ownership Distribution
- Other101.7M (93.76%)
- Mutual Funds6.8M (6.24%)
- Institutions247 (0.0002%)
- Insiders0 (0.00%)